Paul R. Teich, CTO and Senior Analyst, Biography
Paul R. Teich is CTO and Senior Analyst at Moor Insights & Strategy (MI&S) and leads MI&S’s technology research, specializing in cloud and hybrid cloud-client usage models. Paul’s role as CTO is to understand deep technology and communicate what is important, new, or different. Paul assesses the feasibility, human potential, and market opportunity for new technologies. Then he defines market, competitive, and product strategies to profitably commercialize those technologies. Paul creates the deep insight and assumptions behind MI&S’s custom industry scenarios and forecasting which companies use to define disruptive technology, market, and product line strategies. His insightful behavioral market segmentation for the Internet of Things (IoT) helps simplify decision making in complex emerging technology markets.
Paul publishes on a wide range of technology industry topics, and his public writing is available on the MI&S website and on the Slashdot archives. His writing and consulting center on how people will use high-tech products in the future, from devices to services. This includes: datacenter architecture, server design, architecture, and specific server products, hybrid cloud-client usage models, fabric based computing, Internet of Things (IoT), Industrial IoT (IIoT), system-on-chip (SoC) architecture, user experience (UX), and technology evolution. Industry decision makers read Paul’s technical reports, articles, and blogs. Industry leaders and customers invite Paul to speak at events and moderate panel discussions. The technology press seeks out Paul’s input, and his quotes appear in national and international publications.
Paul earned his MS in Technology Commercialization from the University of Texas at Austin McCombs School of Business and his BS in Computer Science from Texas A&M. He has received 11 US patents and is a senior member of ACM and IEEE.
- Find all of Paul’s recent blogs here.
- Intellectual property litigation: see 2015 writing example redacted for general publishing
- US government interaction: in April 2015 represented client in front of Committee for Foreign Investment in the US (CFIUS)
- May ‘15 IoT Dev-Con session – “Network All the Things and Make Them Smart! Distributed, Composable, Federated Systems of Things”
- Nov ‘14 Open Server Summit OSS SOS-5 session – Future of Scale-Out Servers
- Nov ’14 Analysts Perspective on Dell World 2014
- Sep ‘14 Austin IoT Meet-Up talk – Segmenting the World of IoT
- Aug ‘14 ProductCamp Austin 13 session – Where is the Opportunity in an Internet of Things (IoT)?
- Jun ‘14 Dell Networking Roadshow (Chicago and NYC) – The Networking Rules Have Changed
- Aug ’12 ProductCamp Austin 9 session – Which customer are you building the right product for?
- Jan ’11 ProductCamp Austin 6 session – Sizing, Segmenting, and Forecasting Markets (repeated in subsequent events)
- Jan ’11 ProductCamp Austin 6 session – Creating Scenarios for Uncertain Futures (repeated in subsequent events)
- Oct ’06 IDC Worldwide Sales Meeting – voice of a leading customer presentation plus panel participation
- Apr ’05 Microsoft Windows Hardware Engineering Conference session – Multi-Core Processor Technology – Maximizing CPU Performance in a Power-Constrained World
- Apr ’05 Microsoft Windows Hardware Engineering Conference session – Navigating Technology Commercialization Flow
- Aug ’04 Computer Market Analysis Group session – AMD: The PC Market in 2008 – Four Scenarios
- May ‘15 IoT Dev-Con – “Connecting Things: Choosing Among Competing Standards”
- Mar ’14 SxSW Interactive 2015 – “Makers Change the World and Tools Change the Maker”
- Nov ‘14 Open Server Summit – OSS SOS-1 Introduction
- Nov ’14 Dell OEM Solutions CTO Summit – Internet of Things
- Nov ’14 Dell OEM Solutions CTO Summit – Big Data & Analytics
- Aug ‘14 NIWeek – Executive Editor Event (slides here, photos here, external ref here)
- May ’14 TiEcon – Infrastructure of IoT (TiEcon 2014 had 4200 attendees)
- May ’14 TiEcon – Connected Things
- Oct ’13 ARM TechCon – Software Defined Success Factors
Selected Press Quotes
OpenPower Wants to Be Intel Alternative Here and in China, Jeffrey Burt, eWEEK.com, 3/2/2015
OpenPower’s technology base “is clearly also a step above AMD and the ARMv8 server SoC licensees,” [Paul Teich, CTO and senior analyst with Moor Insights and Strategy] wrote. “They are leveraging their HPC market ecosystem base, which is quite different from ARM’s embedded market base.”
Flash forward: How will a storage revolution change software?, Mike Wheatley, SiliconANGLE, 1/21/2015
“The big step will come when we eliminate the difference between main memory and storage,” Teich predicted. “SSDs are not a disruption. They are a last performance bump for mass storage before we get non-volatile system memory.” At that point, he said, “Things really do change a lot.”
How The Internet Of Things Will Impact Data Centers, Processor.com VOL. 36 ISS. 26, 12/26/2014
Paul Teich, CTO and senior analyst at Moor Insights & Strategy, says the IoT encompasses four broad categories: things people travel with; things in people’s environment (primarily surfaces); analytics that bind together people and things; and an accessible, pervasive communication and network infrastructure.
Software Defined Security: The Newest Weapon Against Cyberthreats, Kimberly Warner-Cohen, Global Delivery Report, 10/4/2014
SDS is currently designed for organizations supporting their own infrastructure and data centers. “Midsized businesses will most likely discover this brand new capability through their hosting provider or other remotely managed IT partner,” says Paul Teich, CTO and senior analyst at Moor Insights & Strategy, who recommends these organizations should partner with IT providers who understand the latest in private cloud technology.
HP says ‘The Machine’ will supercharge Android phones to 100TB, James Niccolai, IDG News Service, Computerworld, 6/11/2014
Paul Teich, senior analyst at Moor Insights & Strategy, said memristors could potentially replace DRAM and flash in smartphones, reducing their cost and improving performance and battery life.
MIPS makers ally to steal some of ARM’s thunder, Serdar Yegulalp, InfoWorld Tech Watch, 5/22/2014
Much of the advantage ARM holds over MIPS right now isn’t necessarily technological, but strategic. Analyst Paul Teich with Moor Insights has pointed out how it’s the value-add to the core architecture, as provided by system-on-chip integrators like Calxeda, that have allowed it to dominate.
HP Moonshot Using ARM 64-Bit SoC, John Oram, BSN.com, 5/6/2014
Paul Teich, CTO and Senior Analyst, Moor Insights & Strategy, said, “HP and Foxconn’s partnership should help both of them address substantial challenges in continuing cloud computing R&D investment in spite of purchasing pressures that might lead to a ‘race to the bottom’ for prices and margins.”
AMD HSA: Compute & Graphics On One Silicon Piece, Bill Oliver, Toms IT Pro, 11/13/2013
“Combining AMD’s upcoming HSA compliant APUs with new east-west fabric architectures, like AMD’s Freedom Fabric and HP’s Moonshot, is a potential game changer for many server-side HPC and big data analytics workloads,” said Paul Teich, CTO and senior analyst at Moor Insights & Strategy, a leading high-tech analyst firm.
Imagination to battle ARM with MIPS server chips, James Niccolai, IDG News Service, InfoWorld, 9/30/2013
There’s nothing about ARM that makes it intrinsically more suitable for servers than MIPS, said Paul Teich, senior analyst with Moor Insights and Strategy. Both are based on RISC (Reduced Instruction Set Computer) architectures that lend themselves to low-power designs.
OpenWorld: Oracle Expands x86 Infrastructure Reach With Dell Relationship, Joseph F. Kovar, CRN, 9/25/2013
However, Teich wrote, Dell’s server shipment numbers may be undercounted by analysts because Dell Data Center Services (DCS) produces servers for hyperscale deployments, an area where server numbers are hard to count.
Seeing the data center in a new light, Clay Dillow, Fortune, 9/11/2013
Many hardware companies are working on ways to solve this, says Paul Teich, senior analyst and CTO at Moor Insights & Strategy. Generally, these new architectures involve further integrating storage, networking, and computing/processing at an even more granular level within each rack in order to reduce latency and enhance throughput. Intel is moving in the other direction entirely.
“This architecture that Intel is proposing, enabled by silicon photonics, is almost diametrically opposed,” Teich says. “They’re actually going to separate the major components and make up for it with a low-latency, high bandwidth connection between them.”